Mid-Film

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The state of the art technologies for Substrate Fabrication and Thick Film Photolithography are used in the manufacture of components, microwave modules and displays.

The applications and technology trials presented here demonstrate the use of the Silonex advanced technology to lower costs and reduce time-to-market.

After 3 years of intensive research and development, Silonex is proud to introduce Mid-film - the next generation in substrate technology. Mid-film improves proven thick film and merges novel materials and and processes. This integration increases your product performance without sacrificing reliability or cost.

Mid-film Advantages

Mid-film offers integrated solutions on a single substrate. Your product can better meet the market demands for increased performance and smaller size by having less interconnections. While expanding standard thick film into higher densities and higher performance, STF retains the established reliability and cost effectiveness of thick film on ceramic.

The Strength of a Proven Technology
Thick film is a well established technology. High performance and high reliability applications have used thick film successfully for decades. Stable materials and processes enable the manufacture of large volume microelectronics modules for harsh environments at low cost.

Increased Performance with Higher Integration
Mid-film is the integration of different technologies. Photolithography and chemical etching are used with novel materials to produce unprecedented line width density and repeatability. Combined with standard thick film conductors, resistors and capacitors, mid-film expands the capabilities of thick film modules for wireless telecommunication, instrumentation, telemetry and medical devices such as hearing aids.