Microelectronic Engineering Capabilities

Integrated Manufacturing


Silonex has manufacturing expertise and test facilities that can be combined to fabricate high volume reliable hybrid micro-modules on ceramic or composite substrates as well as standard optoelectronic components.

As part of Casco Products, Silonex has worldwide manufacturing capability including a modern plant in Suzhou China, utilizing Silonex developed processes. This international reach allows leveraging of the potential capacity to serve the clients' needs.

The main plant is equipped with very flexible custom-designed automated manufacturing and test equipment that permits us to cost-effectively handle a wide range of product sizes, shapes and optoelectronic characteristics.

Laboratories are available for prototyping and qualification testing, under ambient and environmentally controlled conditions.

Silonex' broad range of design and manufacturing technologies optimizes value for customers by letting them select cost-effective technologies and manufacturing alternatives. Capabilities include surface mount, chip on board or mixed technologies on both ceramic and composite substrates. By integrating a wide range of electronic packaging technologies under one roof, Silonex can provide the mix that provides optimum solutions to each of its customers.

  • Specialized integration of sensing elements (custom photocell and detector designs)
    • Photocell Front End - 5 million cells produced each year
    • Custom design of silicon photodiode chips
  • Interconnection processes (mid film/etchable thick film on ceramic and FR4 substrates)
    • Mid Film/Etchable Thick Film - 250,000 sq.inch of printed circuits per year
    • Screen Printing
    • Exposition & Wet Etching
    • Laser Trimming
    • Semi-Automatic Inspection
  • Microelectronic packaging (die bonding, wire bonding, encapsulation, hermetic packaging and test)
    • Chip-on-Board & Encapsulation - 5 million. dies per year
    • Die Bonding (manual and automatic)
    • Wire Bonding (ball bonding and wedge bonding, manual and automatic)
    • Epoxy Encapsulation (manual and automatic)
    • Ceramic & PCB Substrates
  • Mechanical assembly and testing
    • 500,000 assemblies each year
    • Over 75 flexible workstations
    • Microscopes, UV Curing Equipment, Soldering & Rework Stations
Silonex Manufacturing Capabilities


Distribution and Support

Silonex has a strong supply chain team, responsible for planning worldwide production, quality assurance and logistics, with a clear commitment to better serve customers.


 
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