Microelectronic Engineering Capabilities
Application Samples
Surface Mount OximeterWhen a customer needed a very small surface mount sensor for an oximeter, Silonex aided in the design of the package to incorporate a photodiode and multiple LED chips. They were mounted directly on black FR4 to minimize stray reflectance. A molded plastic housing surrounds the perimeter of the board to protect it from ambient light and also provides an opaque barrier to prevent cross talk. The housing is then filled flush with optically clear epoxy for bond protection and to prevent dust and other contaminates from building up in the cavities. |
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Surface Mount Encoder SensorThis encoder application required precise placement of individual die at spacing not possible with individual components. This product utilized Silonex's expertise in thick film substrate fabrication, die attach, wire bonding and selective epoxy printing to form a dam to contain the more viscous optical epoxy. The plated through holes of the substrate provide the contacts for surface mounting this device after they are snapped into individual units. |
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Surface Mount Encoder SensorThis very similar encoder product utilizes Silonex's capability to provide multi-element photodiodes as well as single photodiodes, both in the same surface mount package. The thick film substrate, die attachment and wire bonding are similar to the encoder above. These products are manufactured on a 4"x4" plate, which makes fabrication simpler and more cost effective. This picture illustrates a portion of the plate before singulation. The plated through holes provide plated castellations for surface mounting once the substrate is snapped into individual components and the excess ceramic is removed. |
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Spectrometer Sensor ElementThis device is the sensor for a spectrometer. The application required 10 large area photodiodes mounted close together for precise wavelength comparison. The die are mounted directly on FR4, simplifying the optics and assembly at the customer. Epoxy was applied over the bond wires for protection during shipping and final assembly. |
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Sun Load Sensor (Automotive)This product provides the sensor electronics for a sun load sensor for automotive applications (mounted in the top of the dash board). The device this replaces used individual diode components. Silonex helped their customer redesign the board and optics to provide a simpler, more cost effective package. The photodiode components are replaced by individual die (mounted on the backside). The ceramic substrate also provides mounting pads for SMT components, through-hole connector pins and laser trimmable thick film resistors for final adjustment. This makes a more optically consistent end product, simplifying the downstream electronics to which it interfaces. It demonstrates Silonex's capability to fabricate a mixed technology product. |
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LTCC SubstrateThis demonstration substrate was manufactured to show the capabilities of STF module fabrication when used for both die attach (the center section was made for a large IC die) and surface mount components with solder attach. One substrate will work with epoxy die attach, bond wires and soldering. This was designed to replace an LTCC substrate on which a separate thin film module was attached. |
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Quad Photodiode DetectorThis quad detector utilizes four large area photodiodes mounted on a ceramic substrate. This particular product has PC leads for mounting, but could also be made as a surface mount device. A quad detector can be used for positioning by measuring and comparing the output of each photodiode. It can also be used with filters for spectral analysis. |
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Position SensorSilonex can also fabricate less complicated chip-on-board assemblies. This position sensing application required two large area photodiodes precisely located on an "L" shaped FR4 PC board to simplify mounting in the final product. |
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